Includes multiple GPIOs, SMBus interfaces for communicating with the battery and thermal sensors, and a specialized interface to the host CPU via LPC (Low Pin Count) bus.
Key specs to extract (verify these in the PDF)
The is a highly integrated System-on-Chip (SoC) and Super I/O controller, primarily manufactured by Winbond Electronics and later supported by Nuvoton Technology following their acquisition of certain Winbond product lines. wpce773la0dg datasheet pdf verified
When searching for a "verified" datasheet, it is important to use reputable electronic component distributors and archives.
Extended range of -40°C to 105°C (TA). Extended range of -40°C to 105°C (TA)
Holds the Embedded Controller (EC) firmware separate from main BIOS. SMBus / Analog I/O
At its center is a high-performance, low-power embedded controller core. This core executes firmware stored either in an external serial peripheral interface (SPI) flash memory chip or an onboard ROM block. This firmware manages power sequencing and thermal boundaries. 2. Host Interface (LPC) This core executes firmware stored either in an
[SOLVED] WPCE773LA0DG Datasheet PDF Verified and Available
Download Verified WPCE773LA0DG Datasheet PDF